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ESD Design, Characterization, Failure Mechanism and Testing of RF Technologies
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In increasingly expanding wireless communication
market, high speed wired communication, disk drive, and test,
there is a large demand for high performance Radio Frequency
(RF)technology. With the growth of RF technologies and volume of
the market, electrostatic discharge (ESD) protection is becoming
increasingly important in RF technologies from RF CMOS, RF
Silicon Germanium and Gallium Arsenide.
ESD protection in RF technologies is a new and emerging design
and reliability
field. In this area, there is a need to understand the device
physics, failure
mechanisms, latent mechanisms, device testing techniques, new
test systems
and methods, ESD characterization, circuits, circuit design,
computer-aided
design (CAD) methods, and software. This course will focus on
both on-chip
and off-chip ESD protection solutions.
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Failure Modes and Effect Analysis (FMEA) for Semiconductor Industry
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The elimination, control, or reduction of risk
is a total commitment by the
entire organization, and it is more often than not the
responsibility of the
engineering department. Today, the focus is on prevention, and
the emphasis
is to minimize the probability of failure or to minimize the
effect of failure. In
order to achieve this focus, FMEA is commonly used. It is an
analytical
technique used by engineers to ensure that potential problems
have been
considered and addressed. It is a summary of the engineer's
thoughts as he
or she designs a component or a system, or develops a process.
It can also be
applied to non-production areas. It can also help to improve the
quality and
reliability of products and processes. Thus, maintain a
competitive edge of a
company.
In this course, the various type of FMEAs, their steps in
performing the
FMEAs, the common problems encountered, and the recent
advancement in FMEA are discussed. Case studies are given to illustrate the
successfulness of FMEA in industries.
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LED Device Technology and Packaging
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The field of optoelectronics has witnessed a
tremendous growth in the last two decades with continuous advances made in the field of LEDs,
particularly since the breakthrough in the development of the blue and white
LEDs in the early 1990s. With interest in LED research and development
growing rapidly, advances were also made in the area of material systems
supporting the LED industry, including chip substrate and epitaxial growth,
encapsulants, interconnects, package substrates (leadframe, PCB, metal-plated plastics/ceramics and other novel substrates). These
developments has spin-off benefits for a host of other optoelectronic devices including
emitters, detectors and transceivers incorporating IRLEDs, LEDs,
photodiodes, laser diodes and even non-emissive semiconductor devices using III-V
systems.
Optoelectronic devices are devices, which feature both optical
and electronic/electrical characteristics, in the form of light or
near infra-red/UV emission or detection, and with electrical input and/or output,
respectively. With the rapid growth of the optoelectronic industry, there is a
corresponding need to educate personnel involved in this industry to equip
them further in their career. This course is designed to introduce the field of
optoelectronics devices and packaging, using the LED device and packaging as an example to
the participants. It presumes little or no knowledge of optical
devices on the part of the participants. Description of the devices and packaging
aspects are presented in a concise manner, and the theories and equations
involved in understanding the mechanical and thermal stresses in packages
are kept to a minimum, sufficient for understanding the interaction between
properties of material and stress generation, and the knowledge gained is
applied in a practical manner, viz. guiding material selection and good
design practices.
In this course, the packaging aspect of optoelectronic devices
is illustrated by the example in LED device packaging. LED devices, having much in
common with other optoelectronic devices, has requirements ranging from
partially opaque to transparent encapsulating materials, low to high heat
dissipation capabilities, low moisture sensitivity and high reliability when
subjected to thermal and mechanical stress. This course introduces the
participants to the basics of LED packaging as well as the LED device chip
structure, its optical and electrical characteristics.
The various package types and package constructions are
described. The package substrates, encapsulants and interconnects used are also
introduced, together with an understanding of its thermal and mechanical
properties. Later, it is shown how the thermal and mechanical properties of
the materials are linked to the generation of stress and device failure in the
package. It concludes with appropriate material selection and good package
design practices.
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Mechanical Vibration and Acoustic Noise-Analyses, Diagnostics and Attenuation
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This is a course of continuing education for working engineers
in technical fields relevant to noise and vibration. It covers the
fundamental theories and concepts before bridging to practical analysis and case studies,
thus passing complex mathematical modelling and extended programming
analysis. This course is designed to help product engineers, reliability
engineers and designers concerned with practical aspects of vibration
diagnosis and coustics of various engineering systems. The course will provide guidance
relevant to equipment design, consideration on dynamics of vibratory
systems, the use of computer software, and practical solutions for proactive
maintenance improvement. Moreover, it will emphasize understanding of the relevant
phenomena and concepts in order to enable the participants to address a wide
range of practical problems insightfully.
The course instructor will draw on his extensive experience to
illustrate the subject matter with practical examples.
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Wafer Test and Yield Analysis
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Wafer yield has always been an important performance index for a
wafer fabrication plant in meeting increasing demand of semiconductor
business. Yield analysis and management is in turn strongly dependant on
the effectiveness of wafer test methodology.
The first part of this short course introduces the various wafer
test methodologies currently implemented in the present ULSI chip
fabrication industry that includes in-line parametric tests, wafer level
electrical and sort tests. The associated test issues will also be pinpointed.
The second part of the course discusses the various mechanisms
that cause yield-loss in the typical fabrication process, followed by the
corresponding modeling. We will also explore the concepts of various sort
yield models. In the part of yield management systems, concepts of some
commonly-used analytical techniques for design, parameter & test limited
yield, including techniques of design schmoos, wafer zones, wafer patterns,
process windows, product sensitivity and equipment commonality will be
introduced.
